Doosan Tesna: "Acquires shares of Doosan New Technology Investment Fund No. 2 for ₩40B"
Predicted impact: Medium
₩40B share purchase, about 2% of market value and 12% of last year's revenue.
131970 · KOSDAQ · ₩131970 · 두산테스나
Trailing 12 months from filed financial statements, as of H1 2026. Dividend yield: the 2025 dividend per share from the annual report ÷ today's price.
52-week range−50.7% from the high
₩40,500Today: ₩95,500 – ₩100,300₩196,900
Returns
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Signals describe activity, not recommendations. Not financial advice.
Estimated leveraged-ETF rebalance on Oct 27: buy ₩623M at the close (1.1% of 20-day average trading value)
On its 39 biggest days of the last 60 (moves of 3%+), the estimated pressure averaged 4.4% of trading value and pointed the same way 31 of 39 times.
Mostly via futures: index funds hedge with KOSPI 200 / KOSDAQ 150 futures, spread here over the index's largest members by market value.
Final after the close. An intraday "if the close were now" estimate needs real-time prices, which we don't have yet.
Estimate based on ETF size and daily moves; actual trades may differ.
Held by 11 funds.
Estimated from the funds' index or underlying stock.
Futures (2026-11): 96,800
Basis −0.31% · implied rate −7.1%
Open interest 9,910 contracts
Futures and options can lose more than you put in. Figures describe the market; they are not predictions or recommendations. Paper trading only.
Doosan Tesna (두산테스나, KRX: 131970) is listed on KOSDAQ, in the Business services sector. The company was founded in 2002 and specializes in testing, a back-end stage of system semiconductor manufacturing. Its shares closed at ₩97,100 on Oct 27, 2026, up 1.78% on the day, giving it a market value of ₩1.9T.
The company was founded in 2002 and specializes in testing, a back-end stage of system semiconductor manufacturing. It performs wafer testing and package testing, and also runs a die preparation business that sorts good chips from tested wafers into customer-specified arrangements and wafer sizes. Its main product categories include SoC, CIS, MCU and smart card ICs, with die preparation services mainly for smartphone CIS, display driver ICs and fingerprint sensors, and it serves integrated device manufacturers and fabless chip companies, with exports forming the majority of its sales and facilities located in Pyeongtaek, Anseong and Cheongju, South Korea.
Written by AI from the company's latest annual report.
Predicted impact: Medium
₩40B share purchase, about 2% of market value and 12% of last year's revenue.
Predicted impact: Medium
Management guidance of record earnings next year from Samsung and Apple demand; size not quantified.
Predicted impact: Low· Actual: −19.9% vs sector, volume 1.3× normal (5 trading days)
Stock consultation feature on test specialist; earnings outlook already reported, no new size given.
Titles in Korean until English translations are added.
Also known as: Doosan Tesna / 두산테스나 / 131970 / KRX:131970
Source: KRX statistical information